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Semiconductor Manufacturing Equipment×エヌ.エフ.ティ - List of Manufacturers, Suppliers, Companies and Products

Semiconductor Manufacturing Equipment Product List

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Ultra-Precision Machining Examples (IC Package)

Uniform discharge without unevenness, surface roughness Ra ±0.2μ, minimum achievable surface roughness Ra 0.2μ, high-precision discharge machining within ±2μ.

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, that designs and manufactures semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. We have a track record of deliveries in 11 countries, primarily in Japan and Southeast/East Asia, and we provide a wide range of services with advanced technology based on our experience in manufacturing semiconductor manufacturing equipment and precision molds. 【Business Overview】 Surface grinding machines (including CNC) - 62 units Machining centers - 20 units Electrode processing machines - 8 units Electrical discharge machines - 26 units Wire electrical discharge machines - 8 units Small hole electrical discharge machines - 4 units Tool grinding machines - 4 units Milling machines - 11 units *Additionally, we have various measuring instruments, inspection equipment, pressure testing presses, and jigs available. Please feel free to contact us.

  • Mold Design
  • Other semiconductor manufacturing equipment

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[Case Study for Problem Solving] Mold Edition: Improvement of Resin Bleeding in the Lead Section

Changed the grinding direction of the parting surface to the short side! We were able to successfully reduce the bleeding.

We had a challenge with poor plating caused by resin bleeding into the lead section. Here, we would like to introduce a case where our company provided a solution. Although the frame was changed, there was no improvement, and we were struggling to find a solution through mold modifications. In this case, while the usual polishing direction of the parting surface is longitudinal, we changed the polishing direction of the parting surface to the transverse direction (perpendicular to the L/F rolling direction) as a countermeasure against base resin bleeding occurring in the L/F substrate rolling roll. As a result, we were able to successfully reduce the bleeding. [Case Study] ■ Issue: Poor plating due to resin bleeding into the lead section ■ Solution: Improvement through polishing of the parting surface *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Study of Problem Solving] Mold Edition: Measures Against Resin Leakage - Fine Groove Processing

We successfully carved fine grooves in an area 0.5mm wide to stop resin leakage.

We would like to introduce a case where our company solved the issue of resin leakage in slit-type packages for a client. The resin leakage was affecting the substrate ball pad area, resulting in poor yield and causing difficulties. By utilizing NFT design and polishing technology, we successfully stopped the resin leakage by creating two fine grooves in an area of 0.5mm width. [Case Study] ■ Issue: Continuous resin leakage in slit-type packages ■ Solution: Carving multiple fine grooves horizontally on the package to stop the leakage *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Studies for Problem Solving] Equipment Edition: Troubleshooting Existing Equipment

In the event of a problem, we will check the equipment on-site and hold meetings! We will assist in resolving the issue.

We would like to introduce a case where our company resolved issues with aging existing equipment. We were facing difficulties in resolving equipment troubles due to reasons such as the original manufacturer being unable to respond or the manufacturer no longer existing. Therefore, since our company has a wealth of experience in manufacturing and repairing parts for equipment from other companies, we were able to assist in resolving the issues. When problems arise, we also conduct on-site equipment checks and meetings. 【Case Study】 ■ Issues - Troubles with aging existing equipment - The original manufacturer is unable to respond, or the manufacturer has gone out of business ■ Solutions - We have extensive experience in manufacturing and repairing parts for equipment from other companies, allowing us to assist in resolving issues - When problems occur, we conduct on-site equipment checks and meetings *For more details, please refer to the external link page or feel free to contact us.

  • Calibration and repair

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N.F.T. Corporation Business Introduction

N.F.T is a unique group of skilled technicians that continues to challenge itself in the production of precision molds on a micro scale.

N.F.T. Corporation specializes in the design and manufacturing of semiconductor encapsulation molds and components, as well as the design and manufacturing of semiconductor equipment, industrial automation devices, and semiconductor manufacturing-related equipment and machinery. Our experienced technical team works diligently to provide products that satisfy our customers, so please feel free to consult with us. [Example of Our Products] ■ Automatic Molding Device "Across 2by X" - Supports up to 5 presses - 60/100/120 ton presses - Patent pending (Japan) ■ Automatic Molding Device "Across R2" - 60/100/140 ton presses - Dual press operation - Patent No. 3926379 (Japan), Patent No. I331080 (Taiwan), Patent No. ZL 2007 1 0112507.6 (China) For more details, please contact us or download the catalog.

  • Mold Design
  • Other semiconductor manufacturing equipment

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N.F.T. Corporation Company Profile

Careful support by specialized engineers! We will propose the optimal equipment!

N.F.T. Corporation is a company located in Dazaifu City, Fukuoka Prefecture, specializing in the design and manufacturing of semiconductor packaging molds, semiconductor manufacturing equipment, related parts, and peripheral units. With a proven track record in 11 countries, primarily in Japan and Southeast/East Asia, we are trusted for our advanced technology and wide-ranging capabilities. We mainly focus on semiconductor manufacturing equipment and precision molds, and we also offer customization and development based on your concerns and requests. Please feel free to consult with us. 【Business Activities】 ■ Design and manufacturing of semiconductor packaging molds and components ■ Design and manufacturing of semiconductor manufacturing equipment, related parts, and peripheral units *For more details, please refer to the PDF materials or feel free to contact us.

  • Mold Design
  • Other semiconductor manufacturing equipment

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[Case Study of Problem Solving] Molds Edition: Delivery Time and Quality Response for Mold Product Prototypes

We will quickly proceed with the design meeting and the design and production time to deliver the prototype!

We would like to introduce a case where we solved the challenge faced by a company that needed to quickly obtain samples of reflector products. To secure orders from end users, it was necessary to create prototype molds as quickly as possible, submit samples, and ensure quality. In response, we conducted a design meeting on the same day we received the order, swiftly progressed through the design and manufacturing process, and delivered the prototype molds in time for the requested sample delivery date. After that, we achieved a uniform finish on the product surface with our unique finishing process, satisfying the quality requirements. [Case Study] ■ Challenge: Urgently needed samples of reflector products ■ Solution: Quick response to delivery deadlines and unique surface finishing *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Study on Problem Solving] Mold Edition: Securing Profits by Increasing Maximum Production Quantity

Significant increase in the number of shots due to changes in mold design! Achieved 7072 PKG/Shot.

We would like to introduce a case where our company solved the challenge faced by a client who wanted to secure profits from discrete (general-purpose) products. In response to this challenge, we changed the mold design. As a result, the number of units produced significantly increased, achieving 7072 PKG/Shot. [Case Study] ■Challenge: Wanted to secure profits from discrete (general-purpose) products ■Solution: Increased production significantly by changing the mold design, achieving 7072 PKG/Shot *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Study for Problem Solving] Mold Edition: Easily Changing the Thickness of BGA Products

We can accommodate strict product thickness requests! We will achieve thickness changes through spacer replacement.

We would like to introduce a case where our company solved the challenge faced by a client who wanted to easily change the thickness of their products. Previously, changing the thickness of BGA products required replacing the entire cavity set. Therefore, we changed to a new design with an upper mold cavity insert method. Thanks to the discharge precision of the cavity surface and the polishing precision of the spacer thickness that NFT possesses, we were able to meet the strict product thickness requests from Company P. [Case Study] ■Challenge: Wanting to easily change product thickness ■Solution: Achieved thickness change through spacer replacement *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Study for Problem Solving] Mold Edition: Improvement of Lifespan for Moving Pins and Sleeves

The unique NFT technology has doubled the hardness of the movable pins! We have successfully extended their lifespan by three times.

We would like to introduce a case where our company solved the issue faced by a client regarding the short lifespan of movable pins and sleeves in power-type packages. This resulted in opportunity losses and increased lifecycle costs. By utilizing our unique NFT technology to double the hardness of the movable pins, we successfully extended their lifespan by three times. [Case Study] ■ Issue: Short lifespan of movable pins + sleeves (2 months) ■ Solution: Increased hardness of movable pins, extending lifespan to three times (6 months) *For more details, please refer to the external link page or feel free to contact us.

  • Other contract services
  • Other molds

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[Case Study on Problem Solving] Equipment Edition: Automation of Release Shots

Automatic release recovery shots are implemented at arbitrary frequencies during production! Productivity has increased and labor costs have been successfully reduced.

We would like to introduce a case where we solved the issue of needing frequent release recovery shots and poor productivity. They were struggling with the need to stop the machine every time and manually perform release recovery shots, wanting to improve production efficiency. Therefore, we implemented automatic release recovery shots at arbitrary frequencies during production. We successfully achieved a significant increase in productivity. 【Case Study】 ■ Issue: Frequent release recovery shots are needed, and productivity is poor. ■ Solution: Added automatic release recovery shot function to N.F.T manufactured automatic molding machine. *For more details, please refer to the external link page or feel free to contact us.

  • Other services

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